BAS-400 has been developed for small PCB Reworking that optimized for the Min 5*5mm to Max 140*160mm such as laptop, mobile phone, xbox 360, ps3, etc.
● The upper and lower heating zone, temperature precision control within ±1°C. which can heat up at the same time from the top of he component to the bottom of the PCB; 8 segment temperature control independently. automatic mobile phone repair machine.
● Hot air district heating for BGA and PCB at the same time, the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
● Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system.
● temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved; temperature can be tested precisely through external measurement interface, curves can be analysed, set and correct on the touch screen at any time. iphone glued ic repair machine.
● Using high definition and adjustable CCD color optical alignment system, beam split, amplification, lessening, fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment, adjustable image contrast; equipped with 15' high definition LCD monitor.
● Adopting the HD touch human-machine interface; Independently top and bottom reflow heating; providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement.
● X, Y and R angle adopted micrometer fine-tuning, accuracy locating, precision can reach ±0.01mm.
● With alarm function, after the BGA welding the machine can alarm by itself. In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection. Temperature parameter having password protection to prevent any modification.
Model | BAS-400 |
Power supply | AC 220V±10% 50/60Hz |
Total power | Max 2500W |
Heater power | Upper temp. zone 1200W, Down temp. zone 1200W |
Electrical material | Driving motor + Micro controller + Touch screen |
Temperature controlling | K-Type Thermocouple; Closed Loop PID |
Component Alignment | Include true high-definition vision to get ultra-clear, superimposed views of component leads and PCB solder pads |
Positioning | V shape slot and X Y Z Micrometer adjustment |
PCB size | Max 140×160mm Min 5×5mm |
Applicable chips | Max 80×80mm Min 1×1mm |
Overall dimension | L450×W470×H670mm |
Thermocouple input | 1pcs |
Weight | 30KG |
Color | Blue+White |