Mobil Phone Chip Rework

High Precision, Vision Alignment Rework Station.

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1Clicksmt BGA Rework Staiton Advantage

Each member of the Epeius series BGA rework stations is an essential tool for BGA rework. Their different configurations can meet the needs of different customer groups; their accurate optical positioning system ensure that component pins are in alignment with the welding pads. Three temperature zones are independently controlled in a fully programmable way. Its K-type thermocouple input ensures accurate thermal analysis.

Recommended BGA Rework Staiton

BAS-400 BGA Rework Station


BAS-400 has been developed for small PCB Reworking that optimized for the Min 5*5mm to Max 140*160mm such as laptop, mobile phone, xbox 360, ps3,etc.

  • High-definition optical alignment system (1080p).
  • Manual control X- and Y-axis optics positioning.
  • Automatic / Joystick control Z-axis for removal, placement, soldering.
  • Micrometer-adjust X-, Y-, and Ø-axis lead-to-pad alignment.
  • One thermocouple inputs.
  • Universal fixture for small board fixing.

Mobil Phone Chip Rework

  • Mobil Phone Chip Rework
  • BGA specification send us your parts sample.